Modern PCBA Equipment & Processes

To maximize the efficiency of the equipment pictured below we have connected all assembly line components with a flexible and programmable conveyer system.

Universal Fuzion

Universal Fuzion High Speed SMT Pick and Place

  • For Industrial, Telecom, Computer, TV, SetTop Box, Gaming, Tablet
  • 48k cph real throughput
  • Rapid changeover with full feeder bank exchange, family setups
  • 480+ 8mm inputs, 40 random access tray inputs, track feeder support
  • Large PCB size range: up to 508 x 635mm ( 20″ x 25″) w/ 40″ Length Option
  • Increased multifunction and odd-form capacity (25mm tall, 5kg force capable)
  • Extensive component range overlap across all modules for easy balancing
Automatic Optical Inspection

Vi Technology Automatic Optical Inspection (AOI)

  • For Post Print, Mixed Mode, Pre Reflow or Post Reflow applications
  • Inspects boards up to 21” x 24”
  • State-of-the-art XY gantry
  • High-performance systems with state-of-the-art accuracy and repeatability
  • Linear motors with optical encoders
  • Customized authentic telecentric lens
  • Automatic conveyor adjustment
  • Cycle time: from 250 000 up to 400 000 components per hour
ACE Selective Solder

ACE KISS-104 Automated Selective Soldering Machine

  • A completely automated in-line selective Soldering System
  • Handles boards up to 18″ x 24″
  • SMEMA pass through conveyor features automatic conveyor width adjustment and a “crowder” to facilitate positive location of the board
  • Board is maintained stationary during the soldering process preventing components from toppling over causing “unset” inter-metallic fillets
  • Couples high throughput with precise process controls
  • Programmable features provide the tools to set all process parameters, including immersion depths, pre-heat dwells, travel distances and speeds, solder temperature and wave height
  • Will out produce 6 or more operators soldering with an iron while significantly increasing the solder joint quality and to a predictable schedule
Air-Vac Rework Robot

Air-Vac Engineering ONYX 29 Advanced SMT Production Rework & Assembly

  • 7-axis rework robot that provides an unparalleled level of automation and process control for SMT rework and assembly
  • Tool Changer automatically selects and changes nozzles based on program instructions
  • Pick & Prep station provides automatic component pick up and preparaton including flux dipping, paste on device and solder paste dipping
  • Process Development Wizard automatically creates a complete rework process based on user response to five structured prompts
  • Other key functions include fully automated non-contact site cleaning, force-controlled auto placement and motorized vision/zoom
  • Applications include Lead-Free, 0201, Flip Chip, Micro BGA/CSP, MEMS, Optoelectronics, Microwave, MLF’s and other devices. Existing technology including BGA, CSP, Leaded Devices and Surface Mount Connectors can also be easily accommodated.
Reflow Oven
Vitronics Soltec XPM3i Reflow Soldering System
  • Autoset profile/recipe generator
  • 350°C maximum setpoint temperature
  • Flux Flow Control™ flux evacuation system
  • Active forced convection top and bottom cooling cells
Flying Probe

Acculogic Flying Probe tester (Manufacturing Defect Analyzer)

Additional Capability

  • Two redundant lines — 21,000 placements/hour
  • Quad (Tyco) QSP-2 High Speed Multifunctional SMT Assembler (2 units)
    • Maximum Board Dimension: 14” x 18”
    • 14,000 placements/hour
  • Quad (Tyco) QSV-1 High Precision SMT Assembler (2 units)
    • Maximum Board Dimension: 16” x 24”
    • 7,000 placements/hour